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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Thermomechanical Fatigue Testing and Analysis of Solder Alloys
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermomechanical fatigue (TMF) is one of the most common causes of failure in solder joints. TMF occurs due to the introduction of stresses arising from thermal expansion mismatch during thermal ...