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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Presently, stack dice are used widely as low-power memory applications because thermal management of 3D architecture such as high-power processors inherits many thermal challenges. Inadequate thermal ...
Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Comprehensive analysis of microelectronic cooling systems utilizing thermoelectric modules is time consuming because it involves solving many parametric equations, which require solving complex ...