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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Effects of Stacked Layers and Stacked Configurations on Wire Sweep and Wire Sag of Advanced Overhang/Pyramid Stacked Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Overhang and/or pyramid stacked packages are the trend in the semiconductor industry. As the stacked layers increase drastically, the wire sweep and wire sag problems become more and more serious. Based on some types of ...