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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
High Thermal Conductive Si3N4 Particle Filled Epoxy Composites With a Novel Structure
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Traditionally, large quantities of ceramic fillers are added to polymers in order to obtain high thermally conductive polymer composites, which are used for electronic encapsulants. However, that ...
Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A finite element method was developed to predict the effective thermal conductivity of particle filled epoxy composites. Three-dimensional models, which considered the effect of filler geometry, ...