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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: New nondestructive inspection methods with high spatial resolution are expected to support the evaluation and enhancement of the reliability of microjoints on printed circuit boards. An X-ray ...
Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Microjoints by Synchrotron Radiation X-Ray Microtomography
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In high-density packaging technology, one of the most important issues is the reliability of the microjoints connecting large scale integrated circuit chips to printed circuit boards electrically ...