Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-1 of 1
A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Surface mount components soldered with 58Bi–42Sn on printed circuit boards fell off after about 500 cycles of−45°C ↔ 100°C in a thermal chamber. Failure analysis revealed that the ...