Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-1 of 1
Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA) With Through Silicon Via and Copper Pillar Bonding Approach
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This work will specifically detail the development of a processing and fabrication route for a three-dimensional asynchronous field-programmable gate array (3D-AFPGA) design based on an extension of pre-existing ...