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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
On Chip Power Generation Using Ultrathin Thermoelectric Generators
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermoelectric generators (TEGs) can significantly improve the net power consumption and battery life of the low power mobile devices or high performance devices by generating power from their waste heat. Recent advancements ...
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Silicon-based embedded microchannel with three-dimensional (3D) manifold (MF) μ-cooler offers lower pressure drop and increased heat removal capability (>1 kW/cm2) for microprocessors and power electronics cooling using ...
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal management of power electronics modules is one of the limiting factors in the peak power capability of the traction inverter system and overall efficiency of the e-drive. Liquid cooling using embedded microchannels ...