Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-1 of 1
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper investigated the effect of heat spreading on the boiling of the Novec 649™ for two-phase immersion cooling of electronics. Reference pool boiling tests were performed by attaching a 25.4 mm by 25.4 mm square ...