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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Lid Integral Cold Plate Topology: Integration, Performance, and Reliability
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We demonstrate the lidintegral silicon coldplate topology as a way to bring liquid cooling closer to the heat source integrated circuit (IC). It allows us to eliminate one thermal interface material (TIM2), to establish ...