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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The increasing demand for tightly integrated gallium nitride high electron mobility transistors (HEMT) into electronics systems requires accurate thermal evaluation. While these devices exhibit favorable electrical ...
Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: With recent advances in the state-of-the-art of power electronic devices, packaging has become one of the critical factors limiting the performance and durability of power electronics. To this end, this study investigates ...
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This review introduces relevant nanoscale thermal transport processes that impact thermal abatement in power electronics applications. Specifically, we highlight the importance of nanoscale thermal transport mechanisms at ...