Search
Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-1 of 1
Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A design of experiment (DOE) methodology based on numerical simulation is presented to improve thermal fatigue reliability of multirow quad flat nonlead (QFN) packages. In this method, the influences of material properties, ...