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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Characterization of Substrate Materials for System-in-a-Package Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: System-in-a-Package (SiP) aims to integrate the entire system functions within a system-level package containing multiple ICs and other components interconnected in a high-density substrate. A ...