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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Applications of a Decomposed Analysis Procedure for Area-Array Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The goals of the present paper are to apply the recently developed decomposed analysis procedure using a computer code developed in this study. The decomposed technique enables one to determine ...
A System for First Order Reliability Estimation of Solder Joints in Area Array Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, a methodology, and a program based on the methodology, are presented, which, using the reliability of solder joints for various values of design/process parameters, can be estimated ...
Decomposition Techniques for the Efficient Analysis of Area-Array Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The goals of the present paper are to develop and demonstrate an efficient technique for the design/analysis of electronic packages through a novel decomposition procedure. The ultimate utility ...