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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
An Experimental Study of the Enhancement of Air-Cooling Limits for Telecom/Datacom Heat Sink Applications Using an Impinging Air Jet
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An experimental study was conducted to investigate the heat transfer from a parallel flat plate heat sink under a turbulent impinging air jet. A horizontal nozzle plate confined the target ...
Interconnect Joule Heating under Transient Currents using the Transmission Line Matrix Method
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The quality and reliability of interconnects in microelectronics is a major challenge considering the increasing level of integration and high current densities. This work studied the problem of ...
Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Integration of different functional components such as level two (L2) cache memory, high-speed I/O interfaces, and memory controller has enhanced microprocessor performance. In this architecture, ...