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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Lifetime Model for the Fatigue Fracture in Cu/Al2O3/Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Direct bonded copper (DBC) alumina (Al2O3) substrates are used in power electronic devices in order to transfer the heat from semiconductor devices to the heat sink and to carry high electric currents. Fatigue-induced ...