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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Study of Print Release Process in Solder Paste Printing
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Solder paste printing is central to the mass reflow soldering process for surface mount technology. The miniaturization of components has put an increased demand on the printing process and ...