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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Analysis of Solder Paste Release in Fine Pitch Stencil Printing Processes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Advanced electronics packaging technologies such as chip scale packages, fine pitch ball grid arrays, and flip chip are pushing solder paste stencil printing to the limit. In order to achieve ...