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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Application of Impedance Spectroscopy for On-Line Monitoring of Solder Paste
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The technique of impedance spectroscopy is suggested for industrial monitoring of solder paste in the surface mount assembly process. Being an on-line implementable technique, it has the potential ...