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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-4 of 4
The Effect of Variations in Stream-Wise Spacing and Length on Convection From Surface Mounted Rectangular Components
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effect of variations in stream-wise spacing and component length on convection from rectangular, surface mounted components in a channel flow are reported. Component dimensions are the same ...
Forced Convection Air Cooling of Simulated Low Profile Electronic Components: Part 2—Heat Sink Effects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Forced convection air cooling of an array of low profile, card-mounted components has been investigated. A simulated array is attached to one wall of a low aspect ratio duct. This is the ...
Forced Convection Air Cooling of Simulated Low Profile Electronic Components: Part 1—Base Case
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Forced convection cooling of a simulated array of card-mounted electronic components has been investigated. An important feature of the simulated components is their relatively low profile ...
A Study of Forced Convection Direct Air Cooling in the Downstream Vicinity of Heat Sinks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An experimental study of forced convection heat transfer is reported. Direct air cooling of an electronics packaging system is modeled by a channel flow, with an array of uniformly sized and ...