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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Free Abrasive Machining in Slicing Brittle Materials With Wiresaw
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Wiresaw has emerged as a leading technology in wafer preparation for microelectronics fabrication, especially in slicing large silicon wafers (diameter≥300 mm) for both microelectronic and photovoltaic ...