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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The damage mechanisms of carbon nanotubes are considered to be the oxidation by Joule heating and migration of carbon atoms by highdensity electron flows. In this study, a high current density testing system was designed ...
Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Flexible printed circuits (FPCs) are widely used in electronic equipment such as mobile devices and wearable sensors. The conductive electric lines in these circuits are printed using nanoparticle metal ink and ink-jet ...
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Printed electronics (PEs) have attracted attention for the fabrication of microscale electronic circuits. PEs use conductive inks which include metal nanoparticles. The conductive ink can be printed on flexible substrates ...