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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Swing Touch Risk Assessment of Bonding Wires in High-Density Package Under Mechanical Shock Condition
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Long bonding wires may swing significantly and touch with adjacent ones, which will result in short circuit under mechanical condition, especially in aerospace applications. This may seriously affect the operational ...