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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Optimization of Microwave Packaging Structure for Directly Modulated Laser Modules Using Three-Dimensional Electromagnetic Model
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, the packaging aspects of directly modulated laser (DML) modules are investigated using detailed electromagnetic (EM) simulations. The packaging influences of the laser module are ...