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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents a new approach to formulating an analytical model for the underfill process in flip-chip packaging to predict the flow front and the filling time. The new approach is based on the concept of surface ...