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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Latest electronic component package types are pushing the need to more efficiently remove the dissipated heat using optimized thermal paths going through the printed circuit board (PCB) to reach ...