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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Study on Failure Mechanism of PCT Reliability for BT Substrate Based CSP (Chip Scale Package)
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, the study on failure mechanism of moisture sensitivity reliability is reported. It focuses on the PCT conditions which are 121°C, 2atm, 100RH%, and 168 hr. The general ...