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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A dual-phase-lag diffusion (DPLD) model is presented for predicting the intermetallic compound (IMC) layer growth in solder joints. It extends from Fick’s law by taking into account the delayed ...