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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Two-phase immersion cooling (2PIC) has been proposed as a means of economically increasing overall energy efficiency while accommodating increased chip powers and system-level power density. Designers unfamiliar with ...