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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Individual Phase Mechanical Properties at Different Temperatures of Sn–Ag–Cu Lead Free Solders Incorporating Special Pileup Effects Using Nanoindentation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Sn–Ag–Cu (SAC) alloys are considered as good replacements of Sn–Pb alloys which are banned due to the toxic nature of Pb. But, SAC alloys have a coarse microstructure that consists of خ²Sn rich and eutectic phases. ...