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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Five halogen-free (HF) dummy plastic ball grid array (PBGA) components with daisy-chains and Sn4.0Ag0.5Cu (SAC405) Pb-free solder balls were assembled on a HF high density interconnection (HDI) ...
Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, a lead-free dummy plastic ball grid array component with daisy-chains and Sn4.0 Ag0.5 Cu Pb-free solder balls was assembled on an halogen-free high density interconnection printed ...