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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This research seeks to characterize the micro-mechanical behavior of Sn-Ag-Cu solder bumps/joints generated by fine pitch flip chip assembly processes. The solder bumps and joints that were aged ...