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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The growing application of advanced electronic packages under harsh environmental conditions, extreme temperatures especially in automotive applications is often a reason for damage, fatigue, and ...
Determination of Packaging Material Properties Utilizing Image Correlation Techniques
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermo-mechanical reliability in advanced electronic packaging requires new materials testing approaches. The necessary understanding of the impact of very local material stressing on component ...