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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Embedded Cooling for Wide Bandgap Power Amplifiers: A Review
Publisher: American Society of Mechanical Engineers (ASME)
Abstract: Successful utilization of the inherent capability of wide bandgap materials and architectures for radio frequency (RF) power amplifiers (PAs) necessitates the creation of an alternative thermal management paradigm. Recent ...