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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Three-Dimensional Printed Dielectric Substrates for Radio Frequency Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Engineered porous structures are being used in many applications including aerospace, electronics, biomedical, and others. The objective of this paper is to study the effect of three-dimensional (3D)-printed porous ...