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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Reduced Order Design Optimization of Liquid Cooled Heat Sinks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The recent growth in electronics power density has created a significant need for effective thermal management solutions. Liquid-cooled heat sinks or cold plates are typically used to achieve high volumetric power density ...
HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Power densification and rising module heat losses cannot be managed by traditional “external-to-case” cooling solutions. This is especially pronounced in high voltage systems, where intervening layers of insulating material ...
Modular Heat Sinks for Enhanced Thermal Management of Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Power electronics are vital for the generation, conversion, transmission, and distribution of electrical energy. Improving the efficiency, power density, and reliability of power electronics is an important challenge that ...