| contributor author | M. Y. Friedman | |
| contributor author | E. Lenz | |
| date accessioned | 2017-05-09T01:37:05Z | |
| date available | 2017-05-09T01:37:05Z | |
| date copyright | February, 1973 | |
| date issued | 1973 | |
| identifier issn | 1087-1357 | |
| identifier other | JMSEFK-27583#317_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/164147 | |
| description abstract | A solution is presented for the temperature field in the chip under experimental edge conditions in the contact zone and at the upper chip face. The pattern of the temperature gradient in the chip normal to the tool face while turning steel with hard-metal tools is analyzed. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Analysis of Temperature Field in Chip | |
| type | Journal Paper | |
| journal volume | 95 | |
| journal issue | 1 | |
| journal title | Journal of Manufacturing Science and Engineering | |
| identifier doi | 10.1115/1.3438129 | |
| journal fristpage | 317 | |
| journal lastpage | 320 | |
| identifier eissn | 1528-8935 | |
| keywords | Temperature | |
| keywords | Metals | |
| keywords | Steel | |
| keywords | Equipment and tools AND Temperature gradients | |
| tree | Journal of Manufacturing Science and Engineering:;1973:;volume( 095 ):;issue: 001 | |
| contenttype | Fulltext | |