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    Mechanistic Considerations for Enhancing Flow Boiling Heat Transfer in Microchannels

    Source: Journal of Heat Transfer:;2016:;volume( 138 ):;issue: 002::page 21504
    Author:
    Kandlikar, Satish G.
    DOI: 10.1115/1.4031648
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Research efforts on flow boiling in microchannels were focused on stabilizing the flow during the early part of the last decade. After achieving that goal through inlet restrictors and distributed nucleation sites, the focus has now shifted on improving its performance for high heat flux dissipation. The recent worldwide efforts described in this paper are aimed at increasing the critical heat flux (CHF) and reducing the pressure drop, with an implicit goal of dissipating 1 kW/cm2 for meeting the highend target in electronics cooling application. The underlying mechanisms in these studies are identified and critically evaluated for their potential in meeting the high heat flux dissipation goals. Future need to simultaneously increase the CHF and the heat transfer coefficient (HTC) has been identified and hierarchical integration of nanoscale and microscale technologies is deemed necessary for developing integrated pathways toward meeting this objective.
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      Mechanistic Considerations for Enhancing Flow Boiling Heat Transfer in Microchannels

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    contributor authorKandlikar, Satish G.
    date accessioned2017-05-09T01:30:03Z
    date available2017-05-09T01:30:03Z
    date issued2016
    identifier issn0022-1481
    identifier otherht_138_02_021504.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/161507
    description abstractResearch efforts on flow boiling in microchannels were focused on stabilizing the flow during the early part of the last decade. After achieving that goal through inlet restrictors and distributed nucleation sites, the focus has now shifted on improving its performance for high heat flux dissipation. The recent worldwide efforts described in this paper are aimed at increasing the critical heat flux (CHF) and reducing the pressure drop, with an implicit goal of dissipating 1 kW/cm2 for meeting the highend target in electronics cooling application. The underlying mechanisms in these studies are identified and critically evaluated for their potential in meeting the high heat flux dissipation goals. Future need to simultaneously increase the CHF and the heat transfer coefficient (HTC) has been identified and hierarchical integration of nanoscale and microscale technologies is deemed necessary for developing integrated pathways toward meeting this objective.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleMechanistic Considerations for Enhancing Flow Boiling Heat Transfer in Microchannels
    typeJournal Paper
    journal volume138
    journal issue2
    journal titleJournal of Heat Transfer
    identifier doi10.1115/1.4031648
    journal fristpage21504
    journal lastpage21504
    identifier eissn1528-8943
    treeJournal of Heat Transfer:;2016:;volume( 138 ):;issue: 002
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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