Mechanistic Considerations for Enhancing Flow Boiling Heat Transfer in MicrochannelsSource: Journal of Heat Transfer:;2016:;volume( 138 ):;issue: 002::page 21504Author:Kandlikar, Satish G.
DOI: 10.1115/1.4031648Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Research efforts on flow boiling in microchannels were focused on stabilizing the flow during the early part of the last decade. After achieving that goal through inlet restrictors and distributed nucleation sites, the focus has now shifted on improving its performance for high heat flux dissipation. The recent worldwide efforts described in this paper are aimed at increasing the critical heat flux (CHF) and reducing the pressure drop, with an implicit goal of dissipating 1 kW/cm2 for meeting the highend target in electronics cooling application. The underlying mechanisms in these studies are identified and critically evaluated for their potential in meeting the high heat flux dissipation goals. Future need to simultaneously increase the CHF and the heat transfer coefficient (HTC) has been identified and hierarchical integration of nanoscale and microscale technologies is deemed necessary for developing integrated pathways toward meeting this objective.
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contributor author | Kandlikar, Satish G. | |
date accessioned | 2017-05-09T01:30:03Z | |
date available | 2017-05-09T01:30:03Z | |
date issued | 2016 | |
identifier issn | 0022-1481 | |
identifier other | ht_138_02_021504.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/161507 | |
description abstract | Research efforts on flow boiling in microchannels were focused on stabilizing the flow during the early part of the last decade. After achieving that goal through inlet restrictors and distributed nucleation sites, the focus has now shifted on improving its performance for high heat flux dissipation. The recent worldwide efforts described in this paper are aimed at increasing the critical heat flux (CHF) and reducing the pressure drop, with an implicit goal of dissipating 1 kW/cm2 for meeting the highend target in electronics cooling application. The underlying mechanisms in these studies are identified and critically evaluated for their potential in meeting the high heat flux dissipation goals. Future need to simultaneously increase the CHF and the heat transfer coefficient (HTC) has been identified and hierarchical integration of nanoscale and microscale technologies is deemed necessary for developing integrated pathways toward meeting this objective. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Mechanistic Considerations for Enhancing Flow Boiling Heat Transfer in Microchannels | |
type | Journal Paper | |
journal volume | 138 | |
journal issue | 2 | |
journal title | Journal of Heat Transfer | |
identifier doi | 10.1115/1.4031648 | |
journal fristpage | 21504 | |
journal lastpage | 21504 | |
identifier eissn | 1528-8943 | |
tree | Journal of Heat Transfer:;2016:;volume( 138 ):;issue: 002 | |
contenttype | Fulltext |