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contributor authorHuang, Yin
contributor authorYuan, Jianghong
contributor authorZhang, Yingchao
contributor authorFeng, Xue
date accessioned2017-05-09T01:25:51Z
date available2017-05-09T01:25:51Z
date issued2016
identifier issn0021-8936
identifier otherjam_083_10_101005.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/160310
description abstractThe performance of flexible/stretchable electronics may be significantly reduced by the interfacial delamination due to the large mismatch at the interface between stiff films and soft substrates. Based on the theory of viscoelasticity, a cracked composite beam model is proposed in this paper to analyze the delamination of an elastic thin film from a viscoelastic substrate. The timevarying neutral plane of the composite beam is derived analytically, and then the energy release rate of the interfacial crack is obtained from the Griffith's theory. Further, three different states of the crack propagation under constant external loadings are predicted, which has potential applications on the structural design of inorganic flexible/stretchable electronics.
publisherThe American Society of Mechanical Engineers (ASME)
titleInterfacial Delamination of Inorganic Films on Viscoelastic Substrates
typeJournal Paper
journal volume83
journal issue10
journal titleJournal of Applied Mechanics
identifier doi10.1115/1.4034116
journal fristpage101005
journal lastpage101005
identifier eissn1528-9036
treeJournal of Applied Mechanics:;2016:;volume( 083 ):;issue: 010
contenttypeFulltext


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