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    Analytical Solution Based Corner Correction for Transient Thermal Measurement

    Source: Journal of Heat Transfer:;2015:;volume( 137 ):;issue: 011::page 111302
    Author:
    Jiang, H.
    ,
    Chen, W.
    ,
    Zhang, Q.
    ,
    He, L.
    DOI: 10.1115/1.4030980
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The onedimensional (1D) conduction analytical approaches for a semiinfinite domain, widely adopted in the data processing of transient thermal experiments, can lead to large errors, especially near a corner of solid domain. The problems could be addressed by adopting 2D/3D numerical solutions (finite element analysis (FEA) or computational fluid dynamics (CFD)) of the solid field. In addition to needing the access to a conduction solver and extra computing effort, the numerical field solution based processing methods often require extra experimental efforts to obtain full thermal boundary conditions around corners. On a more fundamental note, it would be highly preferable that the experimental data processing is completely free of any numerical solutions and associated discretization errors, not least because it is often the case that the main purposes of many experimental measurements are exactly to validate the numerical solution methods themselves. In the present work, an analyticalsolution based method is developed to enable the correction of the 2D conduction errors in a corner region without using any conduction solvers. The new approach is based on the recognition that a temperature time trace in a 2D corner situation is the result of the accumulated heat conductions in both the normal and lateral directions. An equivalent semiinfinite 1D conduction temperature trace for a correct heat transfer coefficient (HTC) can then be generated by reconstructing and removing the lateral conduction component at each time step. It is demonstrated that this simple correction technique enables the use of the standard 1D conduction analysis to get the correct HTC completely analytically without any aid of CFD or FEA solutions. In addition to a transient infrared (IR) thermal measurement case, two numerical test cases of practical interest with turbine blade tip heat transfer and film cooling are used for validation and demonstration. It has been consistently shown that the errors of the conventional 1D conduction analysis in the near corner regions can be greatly reduced by the new corner correction method.
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      Analytical Solution Based Corner Correction for Transient Thermal Measurement

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    contributor authorJiang, H.
    contributor authorChen, W.
    contributor authorZhang, Q.
    contributor authorHe, L.
    date accessioned2017-05-09T01:19:59Z
    date available2017-05-09T01:19:59Z
    date issued2015
    identifier issn0022-1481
    identifier otherht_137_11_111302.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/158580
    description abstractThe onedimensional (1D) conduction analytical approaches for a semiinfinite domain, widely adopted in the data processing of transient thermal experiments, can lead to large errors, especially near a corner of solid domain. The problems could be addressed by adopting 2D/3D numerical solutions (finite element analysis (FEA) or computational fluid dynamics (CFD)) of the solid field. In addition to needing the access to a conduction solver and extra computing effort, the numerical field solution based processing methods often require extra experimental efforts to obtain full thermal boundary conditions around corners. On a more fundamental note, it would be highly preferable that the experimental data processing is completely free of any numerical solutions and associated discretization errors, not least because it is often the case that the main purposes of many experimental measurements are exactly to validate the numerical solution methods themselves. In the present work, an analyticalsolution based method is developed to enable the correction of the 2D conduction errors in a corner region without using any conduction solvers. The new approach is based on the recognition that a temperature time trace in a 2D corner situation is the result of the accumulated heat conductions in both the normal and lateral directions. An equivalent semiinfinite 1D conduction temperature trace for a correct heat transfer coefficient (HTC) can then be generated by reconstructing and removing the lateral conduction component at each time step. It is demonstrated that this simple correction technique enables the use of the standard 1D conduction analysis to get the correct HTC completely analytically without any aid of CFD or FEA solutions. In addition to a transient infrared (IR) thermal measurement case, two numerical test cases of practical interest with turbine blade tip heat transfer and film cooling are used for validation and demonstration. It has been consistently shown that the errors of the conventional 1D conduction analysis in the near corner regions can be greatly reduced by the new corner correction method.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleAnalytical Solution Based Corner Correction for Transient Thermal Measurement
    typeJournal Paper
    journal volume137
    journal issue11
    journal titleJournal of Heat Transfer
    identifier doi10.1115/1.4030980
    journal fristpage111302
    journal lastpage111302
    identifier eissn1528-8943
    treeJournal of Heat Transfer:;2015:;volume( 137 ):;issue: 011
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian