| contributor author | Namazu, Takahiro | |
| contributor author | Ohtani, Kohei | |
| contributor author | Inoue, Shozo | |
| contributor author | Miyake, Shugo | |
| date accessioned | 2017-05-09T01:18:36Z | |
| date available | 2017-05-09T01:18:36Z | |
| date issued | 2015 | |
| identifier issn | 0094-4289 | |
| identifier other | mats_137_03_031011.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/158152 | |
| description abstract | Reactively bonded solder joints with Al/Ni exothermic films attract much attention in semiconductor and microelectromechanical systems (MEMS) industries. Higher bond strength of the joints is required for longterm mechanical reliability. We have investigated the strength of rectangularsolid single crystal silicon (SCS) specimens with reactively bonded Sn3.5Ag solder joint by using specially developed fourpoint bending test equipment. In this paper, the influences of Al/Ni exothermic film thickness and metallic interlayer on the strength are discussed. The strength increases with increasing Al/Ni film thickness and pressure load during bonding. Metallic interlayer between the solder and SCS also affects the strength because fracture origin is dependent on the types of metals. The obtained results suggest that reacted NiAl is durable against external forces compared with the solder and interlayer. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Influences of Exothermic Reactive Layer and Metal Interlayer on Fracture Behavior of Reactively Bonded Solder Joints | |
| type | Journal Paper | |
| journal volume | 137 | |
| journal issue | 3 | |
| journal title | Journal of Engineering Materials and Technology | |
| identifier doi | 10.1115/1.4030413 | |
| journal fristpage | 31011 | |
| journal lastpage | 31011 | |
| identifier eissn | 1528-8889 | |
| tree | Journal of Engineering Materials and Technology:;2015:;volume( 137 ):;issue: 003 | |
| contenttype | Fulltext | |