Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model

Abstract

Temperature rise could be a crucial issue for some electronic connectors subjected to the relative large electrical current. A nonstatistical multiscale sinusoidal rough surface (MSRS) model is adopted to estimate the contact area between matched metallic terminals as a function of contact load. A fast Fourier transform (FFT) is conducted to characterize the measured surface topology of the terminals. Multiphysics threedimensional (3D) finite element analysis (FEA) is then carried out to evaluate the temperature rise of mated microuniversal serial bus (USB) connectors. Temperature distributions of the terminal based on the numerical simulations are in good agreement with those based on the measurements using a thermal couple and an infrared thermal camera as well.