Show simple item record

contributor authorTiwari, Shreevant
contributor authorMcDowell, David L.
date accessioned2017-05-09T01:14:49Z
date available2017-05-09T01:14:49Z
date issued2015
identifier issn0021-8936
identifier otherjam_082_09_091011.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/156997
description abstractIn this research, we have employed molecular dynamics (MD) simulations to computationally explore the effects of hydrostatic stress on the shear deformation behavior of nanocrystalline (NC) Cu, over a range of grain size (5–20 nm) and temperature (10–500 K). Simulated nanocrystals were deformed under shear with superimposed isotropic tensile/compressive hydrostatic stress دƒâˆ§ of magnitude up to 5 GPa. The results suggest that the shear strength increases under imposed compressive دƒâˆ§, and decreases under imposed tensile دƒâˆ§, by around 0.05–0.09 GPa for every GPa of imposed hydrostatic pressure. At 300 K, we computed activation volumes (3.5–9 b3) and activation energies (0.2–0.3 eV), with values agreeing with those reported in previous experimental and theoretical work, notwithstanding the extreme deformation rates imposed in MD simulations. Additionally, we observed that shear deformation under an imposed compressive hydrostatic stress tends to slightly increase both the activation volumes and the energy activation barrier. Finally, no discernible pressure effect could be observed on the distribution of inelastic shear strain.
publisherThe American Society of Mechanical Engineers (ASME)
titleShear Deformation Behavior of Copper Nanocrystals Under Imposed Hydrostatic Stress
typeJournal Paper
journal volume82
journal issue9
journal titleJournal of Applied Mechanics
identifier doi10.1115/1.4030853
journal fristpage91011
journal lastpage91011
identifier eissn1528-9036
treeJournal of Applied Mechanics:;2015:;volume( 082 ):;issue: 009
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record