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contributor authorLewis, Ryan
contributor authorLin, M.
contributor authorWang, Yunda
contributor authorCooper, Jill
contributor authorBradley, Peter
contributor authorRadebaugh, Ray
contributor authorHuber, Marcia
contributor authorLee, Y. C.
date accessioned2017-05-09T01:02:51Z
date available2017-05-09T01:02:51Z
date issued2013
identifier issn1948-5085
identifier othertsea_5_3_031003.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/153239
description abstractJouleThomson (JT) based micro cryogenic coolers (MCCs) are attractive because they can provide the cryogenic temperatures needed for small electronic devices while having a low cost and small volumetric footprint. A compressor is a major part of a cryogenic system, but so far JT based MCCs have not used miniature or microscale compressors. This work demonstrates a JT based MCC coupled with a miniature compressor for cooling to 200 K, with precooling of 273 K, using a custom hydrocarbon mixture as refrigerant. The compressor is formed by coupling a miniature piston oscillator built for stirling coolers with a micromachined check valve assembly. The MCC is formed by glass fibers within a capillary forming a counter flow heat exchanger, and a silicon and glass chip forming a JT valve. Minimum temperatures of 166 K have been observed in transient, and stable temperatures of 200 آ±1 K have been observed for >1 h. Some insight is given into the unstable performance in terms of intermittent liquid accumulation. The coefficient of performance is analyzed for the system, and it is found that most of the inefficiencies arise at the compressor.
publisherThe American Society of Mechanical Engineers (ASME)
titlePerformance Analysis of an Integrated Micro Cryogenic Cooler and Miniature Compressor for Cooling to 200 K
typeJournal Paper
journal volume5
journal issue3
journal titleJournal of Thermal Science and Engineering Applications
identifier doi10.1115/1.4023307
journal fristpage31003
journal lastpage31003
identifier eissn1948-5093
treeJournal of Thermal Science and Engineering Applications:;2013:;volume( 005 ):;issue: 003
contenttypeFulltext


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