Show simple item record

contributor authorDayal, Govind
contributor authorNadeem Akhtar, Syed
contributor authorRamakrishna, S. Anantha
contributor authorRamkumar, J.
date accessioned2017-05-09T01:01:48Z
date available2017-05-09T01:01:48Z
date issued2013
identifier issn2166-0468
identifier otherjmnm_001_03_031002.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/152871
description abstractExcimer laser micromachining using binary mask projection has been investigated for rapid patterning of single micrometer features over large areas of various substrates. Simple limit for depth of focus that determines the depth to width aspect ratios is given and verified for different materials. Binary mask projection technique is found to conformally reproduce the mask features from the millimetre to the micrometer scale under proper focusing conditions. Large arrays of 1 خ¼m and 15 خ¼m holes on Kapton are made with high resolution and uniform periodicity. Material removal rate (MRR) for the laser machining of these holes are examined and the machining efficiency for these are found to have different dependence on the fluence. A saturation of holedepth with increasing number of pulses is obtained.
publisherThe American Society of Mechanical Engineers (ASME)
titleExcimer Laser Micromachining Using Binary Mask Projection for Large Area Patterning With Single Micrometer Features
typeJournal Paper
journal volume1
journal issue3
journal titleJournal of Micro and Nano
identifier doi10.1115/1.4024880
journal fristpage31002
journal lastpage31002
identifier eissn1932-619X
treeJournal of Micro and Nano-Manufacturing:;2013:;volume( 001 ):;issue: 003
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record