An Experimental Investigation of the Heat Transfer Performance of an Oscillating Heat Pipe With Copper Oxide (CuO) Microstructure Layer on the Inner SurfaceSource: Journal of Heat Transfer:;2013:;volume( 135 ):;issue: 007::page 74504DOI: 10.1115/1.4023749Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents an experimental investigation of whether heat transfer performance in an oscillating heat pipe (OHP) would improve if the inner surface of the heat pipe was coated with a layer of copper oxide (CuO). The OHP had six turns and three sections, i.e., evaporator, condenser, and adiabatic section with lengths of 40 mm, 64 mm, and 51 mm, respectively. The cleaned copper tubing was chemically treated with a chemical solution and heated in a furnace. A microstructure layer of CuO was formed in the inner surface of the OHP with K2S2O8 and KOH. The working fluid in this study was water with filling ratios ranging from 40% to 70%. The experimental results show that the CuO microstructure layer is superhydrophilic and can enhance the OHP heat transfer performance. The investigation results in a new way to enhance the heat transfer performance of an OHP.
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contributor author | Ji, Yulong | |
contributor author | Xu, Chen | |
contributor author | Ma, Hongbin | |
contributor author | Xinxiang, Pan | |
date accessioned | 2017-05-09T00:59:51Z | |
date available | 2017-05-09T00:59:51Z | |
date issued | 2013 | |
identifier issn | 0022-1481 | |
identifier other | ht_135_7_074504.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/152168 | |
description abstract | This paper presents an experimental investigation of whether heat transfer performance in an oscillating heat pipe (OHP) would improve if the inner surface of the heat pipe was coated with a layer of copper oxide (CuO). The OHP had six turns and three sections, i.e., evaporator, condenser, and adiabatic section with lengths of 40 mm, 64 mm, and 51 mm, respectively. The cleaned copper tubing was chemically treated with a chemical solution and heated in a furnace. A microstructure layer of CuO was formed in the inner surface of the OHP with K2S2O8 and KOH. The working fluid in this study was water with filling ratios ranging from 40% to 70%. The experimental results show that the CuO microstructure layer is superhydrophilic and can enhance the OHP heat transfer performance. The investigation results in a new way to enhance the heat transfer performance of an OHP. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | An Experimental Investigation of the Heat Transfer Performance of an Oscillating Heat Pipe With Copper Oxide (CuO) Microstructure Layer on the Inner Surface | |
type | Journal Paper | |
journal volume | 135 | |
journal issue | 7 | |
journal title | Journal of Heat Transfer | |
identifier doi | 10.1115/1.4023749 | |
journal fristpage | 74504 | |
journal lastpage | 74504 | |
identifier eissn | 1528-8943 | |
tree | Journal of Heat Transfer:;2013:;volume( 135 ):;issue: 007 | |
contenttype | Fulltext |