Predicted Response of the Die-Carrier Assembly in Flexible Electronics to the Combined Action of Tension and Bending Applied to the Carrier

Abstract

A die-carrier assembly, subjected to the external tensile forces and bending moments applied to the flexible carrier is considered. The objective of the analysis is to develop a simple, easy-to-use, and physically meaningful predictive analytical (“mathematical”) model aimed at understanding the physics of the combined action of tension and bending experienced by the carrier and transmitted to the die through the more-or-less compliant bond. The addressed stresses include the interfacial shearing and peeling stresses, as well as the normal stress acting in the cross sections of the die. The obtained formulae can be used in the analysis and design of assemblies of the type in question.