| contributor author | B. S. Yilbas | |
| contributor author | C. Karatas | |
| contributor author | S. S. Akhtar | |
| date accessioned | 2017-05-09T00:45:33Z | |
| date available | 2017-05-09T00:45:33Z | |
| date copyright | April, 2011 | |
| date issued | 2011 | |
| identifier issn | 1087-1357 | |
| identifier other | JMSEFK-28447#024503_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/146917 | |
| description abstract | Laser cutting of small diameter holes in alumina tiles is carried out. Temperature and stress fields are predicted numerically using the ABAQUS finite element code. The cut sections are examined by incorporating scanning electron microscope and optical microscope. The residual stress developed in the cutting section is determined using the X-ray diffraction technique. It is found that high residual stresses are formed in the cutting section, and predictions agree well with the experimental results. The laser cut edges are found to be free from the large cracks. However, interconnected shallow cracks are observed at the hole cut surface. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Laser Cutting of Small Diameter Holes Into Alumina Tiles: Thermal Stress Analysis | |
| type | Journal Paper | |
| journal volume | 133 | |
| journal issue | 2 | |
| journal title | Journal of Manufacturing Science and Engineering | |
| identifier doi | 10.1115/1.4003737 | |
| journal fristpage | 24503 | |
| identifier eissn | 1528-8935 | |
| keywords | Temperature | |
| keywords | Lasers | |
| keywords | Stress | |
| keywords | Thermal stresses | |
| keywords | Laser cutting | |
| keywords | Cutting | |
| keywords | Tiles | |
| keywords | Heating AND Fracture (Materials) | |
| tree | Journal of Manufacturing Science and Engineering:;2011:;volume( 133 ):;issue: 002 | |
| contenttype | Fulltext | |