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    Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces

    Source: Journal of Heat Transfer:;2011:;volume( 133 ):;issue: 008::page 82401
    Author:
    Javier V. Goicochea
    ,
    Ming Hu
    ,
    Bruno Michel
    ,
    Dimos Poulikakos
    DOI: 10.1115/1.4003533
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Two mechanisms that enhance heat dissipation at solid-liquid interfaces are investigated from the atomistic point of view using nonequilibrium molecular dynamics simulation. The mechanisms include surface functionalization, where –OH terminated headgroups and self-assembled monolayers (SAMs) with different chain lengths are used to recondition and modify the hydrophilicity of silica surface, and vibrational matching between crystalline silica and liquid water, where three-dimensional nanopillars are grown at the interface in the direction of the heat flux with different lengths to rectify the vibrational frequencies of surface atoms. The heat dissipation is measured in terms of the thermal conductance of the solid-liquid interface and is obtained by imposing a one-dimensional heat flux along the simulation domain. A comparison with reported numerical and experimental thermal conductance measurements for similar interfaces indicates that the thermal conductance is enhanced by 1.8–3.2 times when the silica surface is reconditioned with hydrophilic groups. The enhancement is further promoted by SAMs, which results in a 20% higher thermal conductance compared with that of the fully hydroxylated silica surface. Likewise, the presence of nanopillars enhances the interface thermal conductance by 2.6 times compared with a bare surface (without nanopillars). Moreover, for different nanopillar densities, the conductance increases linearly with the length of the pillar and saturates at around 4.26 nm. Changes in the vibrational spectrum of surface atoms and water confinement effects are found to be responsible for the increase in conductance. The modification of surface vibrational states provides a tunable path to enhance heat dissipation, which can also be easily applied to other fluids and interfaces.
    keyword(s): Heat , Atoms , Thermal conductivity , Electrical conductance , Quartz , Water , Mechanisms , Simulation , Heat transfer , Energy dissipation , Columns (Structural) , Chain , Fluids , Temperature , Oxygen , Silicon , Density AND Frequency ,
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      Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/146644
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    contributor authorJavier V. Goicochea
    contributor authorMing Hu
    contributor authorBruno Michel
    contributor authorDimos Poulikakos
    date accessioned2017-05-09T00:44:58Z
    date available2017-05-09T00:44:58Z
    date copyrightAugust, 2011
    date issued2011
    identifier issn0022-1481
    identifier otherJHTRAO-27919#082401_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/146644
    description abstractTwo mechanisms that enhance heat dissipation at solid-liquid interfaces are investigated from the atomistic point of view using nonequilibrium molecular dynamics simulation. The mechanisms include surface functionalization, where –OH terminated headgroups and self-assembled monolayers (SAMs) with different chain lengths are used to recondition and modify the hydrophilicity of silica surface, and vibrational matching between crystalline silica and liquid water, where three-dimensional nanopillars are grown at the interface in the direction of the heat flux with different lengths to rectify the vibrational frequencies of surface atoms. The heat dissipation is measured in terms of the thermal conductance of the solid-liquid interface and is obtained by imposing a one-dimensional heat flux along the simulation domain. A comparison with reported numerical and experimental thermal conductance measurements for similar interfaces indicates that the thermal conductance is enhanced by 1.8–3.2 times when the silica surface is reconditioned with hydrophilic groups. The enhancement is further promoted by SAMs, which results in a 20% higher thermal conductance compared with that of the fully hydroxylated silica surface. Likewise, the presence of nanopillars enhances the interface thermal conductance by 2.6 times compared with a bare surface (without nanopillars). Moreover, for different nanopillar densities, the conductance increases linearly with the length of the pillar and saturates at around 4.26 nm. Changes in the vibrational spectrum of surface atoms and water confinement effects are found to be responsible for the increase in conductance. The modification of surface vibrational states provides a tunable path to enhance heat dissipation, which can also be easily applied to other fluids and interfaces.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleSurface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces
    typeJournal Paper
    journal volume133
    journal issue8
    journal titleJournal of Heat Transfer
    identifier doi10.1115/1.4003533
    journal fristpage82401
    identifier eissn1528-8943
    keywordsHeat
    keywordsAtoms
    keywordsThermal conductivity
    keywordsElectrical conductance
    keywordsQuartz
    keywordsWater
    keywordsMechanisms
    keywordsSimulation
    keywordsHeat transfer
    keywordsEnergy dissipation
    keywordsColumns (Structural)
    keywordsChain
    keywordsFluids
    keywordsTemperature
    keywordsOxygen
    keywordsSilicon
    keywordsDensity AND Frequency
    treeJournal of Heat Transfer:;2011:;volume( 133 ):;issue: 008
    contenttypeFulltext
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