YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Engineering Materials and Technology
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Engineering Materials and Technology
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Effect of Meso to Micro Transition in Morphology Dependent Fracture of SiC Ceramics

    Source: Journal of Engineering Materials and Technology:;2011:;volume( 133 ):;issue: 004::page 41001
    Author:
    Hongsuk Lee
    ,
    Vikas Tomar
    DOI: 10.1115/1.4004686
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Silicon carbide (SiC) is an important ceramic material usually found in polycrystalline form with grain boundary thickness ranging from a few nanometers to a few hundred nanometers and grains with multiple orientations with sizes of the order of few micrometers. The present work focuses on analyzing how the interplay between different orientations of SiC grains and different grain boundary thicknesses can be exploited for targeted improvement in the fracture resistance properties of SiC. Crack propagation simulations using the cohesive finite element method (CFEM) are performed on the finite element meshes developed on experimentally processed SiC morphologies. Analyses were performed at two different length scales: 300 μm × 60 μm (scale-1:Microscale) and 75 μm × 15 μm (scale-2:Mesoscale). Lower resolution microstructure at scale-1 does not explicitly consider the presence of grain boundaries (GBs). Higher resolution microstructure at scale-2 explicitly models GBs. Results indicate that the effect of change in grain orientation is on crack path only. The fracture resistance is not significantly affected. The presence of GBs may directly aid in strengthening a microstructure’s fracture resistance. However, indirectly it may weaken a microstructure by favoring the formation of microcracks. Significantly higher crack formation in grain interior while lower interfacial energy dissipation in comparison to interfaces indicates overall lower fracture strength of grain interiors in comparison to interfaces. If GBs are not accounted for, the second most influencing factor affecting fracture strength is the average grains size. Overall, it is mainly the GBs not the grain orientation distribution and grain size that significantly affects fracture strength.
    keyword(s): Finite element analysis , Fracture (Process) , Energy dissipation , Electrical resistance AND Microcracks ,
    • Download: (3.079Mb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Effect of Meso to Micro Transition in Morphology Dependent Fracture of SiC Ceramics

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/146127
    Collections
    • Journal of Engineering Materials and Technology

    Show full item record

    contributor authorHongsuk Lee
    contributor authorVikas Tomar
    date accessioned2017-05-09T00:43:52Z
    date available2017-05-09T00:43:52Z
    date copyrightOctober, 2011
    date issued2011
    identifier issn0094-4289
    identifier otherJEMTA8-27146#041001_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/146127
    description abstractSilicon carbide (SiC) is an important ceramic material usually found in polycrystalline form with grain boundary thickness ranging from a few nanometers to a few hundred nanometers and grains with multiple orientations with sizes of the order of few micrometers. The present work focuses on analyzing how the interplay between different orientations of SiC grains and different grain boundary thicknesses can be exploited for targeted improvement in the fracture resistance properties of SiC. Crack propagation simulations using the cohesive finite element method (CFEM) are performed on the finite element meshes developed on experimentally processed SiC morphologies. Analyses were performed at two different length scales: 300 μm × 60 μm (scale-1:Microscale) and 75 μm × 15 μm (scale-2:Mesoscale). Lower resolution microstructure at scale-1 does not explicitly consider the presence of grain boundaries (GBs). Higher resolution microstructure at scale-2 explicitly models GBs. Results indicate that the effect of change in grain orientation is on crack path only. The fracture resistance is not significantly affected. The presence of GBs may directly aid in strengthening a microstructure’s fracture resistance. However, indirectly it may weaken a microstructure by favoring the formation of microcracks. Significantly higher crack formation in grain interior while lower interfacial energy dissipation in comparison to interfaces indicates overall lower fracture strength of grain interiors in comparison to interfaces. If GBs are not accounted for, the second most influencing factor affecting fracture strength is the average grains size. Overall, it is mainly the GBs not the grain orientation distribution and grain size that significantly affects fracture strength.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleEffect of Meso to Micro Transition in Morphology Dependent Fracture of SiC Ceramics
    typeJournal Paper
    journal volume133
    journal issue4
    journal titleJournal of Engineering Materials and Technology
    identifier doi10.1115/1.4004686
    journal fristpage41001
    identifier eissn1528-8889
    keywordsFinite element analysis
    keywordsFracture (Process)
    keywordsEnergy dissipation
    keywordsElectrical resistance AND Microcracks
    treeJournal of Engineering Materials and Technology:;2011:;volume( 133 ):;issue: 004
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian